Semiconductor Integrated Circuit: Device Design, Modeling, Simulation, and Application, (Hardcover)

★★★★★ 4.7 112 reviews

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<p>This book covers advanced techniques and tools for electronic design automation, low-power integrated circuit design techniques, Internet of Things-enabled energy systems, and analog and radio frequency applications. </p><p>Features: </p><ul> <li>Discusses advanced fabrication methods, nanofabrication techniques, and the use of novel materials like graphene, and carbon nanotubes in electronic systems.</li> <li>Covers efficient design algorithms, integrated techniques, and tools for designing innovative devices for future technologies and applications.</li> <li>Illustrates thrust areas of semiconductor integrated circuit design such as low-power logic, analog circuits, interconnects, bulk memories, and energy harvesting devices.</li> <li>Explains low-power energy harvesting techniques, their applications, and efficient design of optoelectronic and energy harvesting devices.</li> <li>Illustrates power reduction techniques using algorithms, and the use of 2D materials for the design of low-power devices.</li> </ul><p>The text is primarily written for senior undergraduates, graduate students, and academic researchers in electrical engineering, electronics and communication engineering, integrated circuits, semiconductor devices, and computer engineering.</p>

  • Semiconductor Integrated Circuit: Device Design, Modeling, Simulation, and Application, (Hardcover)
  • Author: Suman Lata Tripathi
  • ISBN: 9781041082187
  • Format: Hardcover
  • Publication Date: 2026-11-06
  • Page Count: 424
Book format Hardcover
Fiction/nonfiction Non-Fiction
Genre Computing & Internet
Publication date November, 2026
Pages 424
Subgenre Electronics
Series title No Series
Number in series 0
Edition 1
Publisher CRC Press
Language English
Is collectible N
Binding type Case Binding
Recording time 0 min
Retail packaging Single Piece
Assembled product dimensions (l x w x h) 6.13 x 6.00 x 9.19 in
Assembled product weight 1.25 lb
Bisac subject heading Technology & Engineering

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